14 FINAL FINISHES N/A

14.1 Selective Strip / Selective Plate Process N/A

14.1.1.P If required, is there a procedure for the control of the selective strip process? YES/NO/NA

14.1.2.P If required, is there a procedure for the control of the selective plate process? YES/NO/N/A

Selective Strip / Selective Plate Process COMPLIANCE

14.1.1.C Is the selective strip being controlled as specified in the procedure? YES/NO/N/A

14.1.2.C Is the selective plate being controlled as specified in the procedure? YESNO/N/A

14.2 Hot Air Solder Leveling (HASL) N/A

14.2.1.P Is there a procedure for HASL? YES/NO

14.2.2.P Is the maximum permitted thermal excursions specified and is there a mechanism for tracking the number of thermal excursions? YES/NO

14.2.3.P Is there a procedure to obtain Customer approval if the maximum number of

Passes through the process specified is exceeded (never to exceed 3 without Customer approval)? YES/NO/N/A

14.2.4.P Is there a procedure for the cleaning process after HASL? YES/NO

Hot Air Solder Leveling (HASL) COMPLIANCE

14.2.1.C Is there objective evidence that solder reservoir testing for copper and other impurities was performed in accordance with IPC-6012? YES/NO

14.2.2.C Is there objective evidence that the monitoring of solder temperature per process lot was in accordance with the procedure? YES/NO

14.2.3.C Is the number of thermal excursions recorded as stated in the procedure? YES/NO

14.2.4.C If the maximum number of thermal excursions is exceeded was Customer approval obtained? YES/NO/N/A

14.2.5.C Is there verification of the angle and pressure of the air knives? YES/NO

14.2.6.C Is cleaning performed after HASL according to the procedure? YES/NO

14.3 Fused Tin Lead N/A

14.3.1.P Is there a procedure for fused tin lead finishing? YES/NO

14.3.2.P Is the maximum permitted reflow cycles specified and is there a mechanism for tracking the number of reflow cycles? YES/NO

14.3.3.P Is there a procedure to obtain Customer approval if the maximum number of reflow cycles specified is exceeded (never to exceed 3 without Customer approval)? YES/NO/N/A

14.3.4.P Is there a cleaning process for removal of flux after fusing? YES/NO

Fused Tin Lead COMPLIANCE

14.3.1.C If required by Customer,is the thickness of the fused tin lead recorded as a quality record? YES/NO/N/A

14.3.2.C If this is a hot oil reflow/fuse process,is there a preheat bath? YES/NO/N/A

14.3.3.C If this is a hot oil reflow/fuse process, is there a separate bath for final fuse? YES/NO/N/A

14.3.4.C Is the number of reflow cycles recorded as stated in the procedure? YES/NO

14.3.5.C Is cleaning performed after fusing according to the procedure? YES/NO

14.3.6.C If the maximum number of thermal excursions is exceeded, was Customer approval obtained? YES/NO/N/A

One of the following two questions (14.3.7.C or 14.3.8.C) shall be be answered, both cannot be marked N/A:

14.3.7.C If hot oil fusing is used, is the process being monitored and controlled for temperature? YES/NO/N/A

14.3.8.C If infrared fusing is used, is the process beng monitored for the infrared energy level?YES/NO/N/A

Audit Note: N/A applies if infrared fusing is not used.

14.3.9.C Is the final finish being evaluated with respect to wetting of the tin-lead coating? YES/NO

14.3.10.C If manual scrubbing is used in the final clean process,is there an inspection to assure that there is no smear between traces? YES/NO/N/A

14.4 Electroless Nickel – Immersion Gold (ENIG) N/A

14.4.1.P Is there a procedure for the ENIG finish? YES/NO

14.4.2.P Is there a procedure establishing that chemical parameters are within the chemistry Suppliers’ recommendations? YES/NO

Electroless Nickel - Immersion Gold (ENIG) COMPLIANCE

14.4.1.C Is the thickness of the nickel and gold recorded as a quality record? YES/NO

14.4.2.C Is X-Ray Fluorecence (XRF) being used to measure thickness of nickel and gold? YES/NO

14.4.3.C Is the process being monitored and controlled for temperature per manufacturer’s specifications? YES/NO

14.4.4.C Is the bath chemistry monitored and controlled per manufacturer’s recommendations?

YES/NO

14.4.5.C If manual scrubbing is used in the final clean process, is there an inspection to assure that there is no smear between traces? YES/NO/N/A

14.5 Immersion Silver N/A

14.5.1.P Is there a procedure for immersion silver finishing? YES/NO

14.5.2.P Is there a procedure establishing that chemical parameters are within the chemistry Suppliers’ recommendations? YES/NO

Immersion Silver COMPLIANCE

14.5.1.C If the line is vertical, does the agitation assure solution flow through the holes? YES/NO/

N/A

14.5.2.C Is the process to monitor the copper level for maximum copper concentration in accordance with the procedure being followed? YES/NO

14.5.3.C Is XRF being used to measure thickness? YES/NO

14.5.4.C Is the thickness recorded as a quality record? YES/NO

14.5.5.C Is the process being monitored and controlled for temperature per manufacturer’s specifications? YES/NO

14.5.6.C Is the bath chemistry monitored and controlled per manufacturer’s recommendations? YES/NO

14.5.7.C Is the time (immersion time and / or conveyor speed) in solution monitored and controlled? YES/NO

14.5.8.C If manual scrubbing is used in the final clean process, is there an inspection to assure there is no smear between traces? YES/NO/N/A

14.6 Immersion Tin N/A

14.6.1.P Is there a procedure for immersion tin finishing? YES/NO

14.6.2.P Is there a procedure establishing that chemical parameters are within the chemistry Suppliers’ recommendations? YES/NO

Immersion Tin COMPLIANCE

14.6.1.C If the line is vertical, does the agitation assure solution flow through the holes? YES /NO/N/A

14.6.2.C Is the process to monitor the copper level for maximum copper concentration in accordance with the procedure being followed? YES/NO

14.6.3.C Is XRF being used to measure thickness? YES/NO

14.6.4.C Is the thickness recorded and does it meet the minimum thickness specified by the Customer? YES/NO

14.6.5.C Is the process being monitored and controlled for temperature per the manufacturer’s specifications? YES/NO

14.6.6.C Is the bath chemistry monitored and controlled per manufacturer’s recommendations? YES/NO

14.6.7.C Is the time in solution monitored and controlled? YES/NO

14.6.8.C If manual scrubbing is used in the final clean process, is there an inspection to assure that there is no smear between traces? YES/NO/N/A

14.7 Electroplated Nickel – Gold N/A

14.7.1.P Is there a procedure for electroplated nickel-gold finishing? YES/NO

14.7.2.P Is there a procedure establishing that chemical parameters are within the chemistry Suppliers’ recommendations? YES/NO

Electroplated Nickel-Gold COMPLIANCE

14.7.1.C Is the bath chemistry monitored and controlled per manufacturer’s recommendations? YES/NO

14.7.2.C Is XRF being used to measure thickness? YES/NO

14.7.3.C Is the thickness recorded as a quality record? YES/NO

14.7.4.C Is the process being monitored and controlled for temperature per manufacturer’s specifications? YES/NO

14.7.5.C Is preventative maintenance performed for cleaning of electrical contact areas?

YES/NO

14.7.6.C If manual scrubbing is used in the final clean process, is there an inspection to assure that there is no smear between traces? YES/NO/N/A

14.8 Electroplated Gold N/A

14.8.1.P Is there a procedure for electroplated gold? YES/NO

14.8.2.P Is there a procedure establishing that chemical parameters are within the chemistry Suppliers’ recommendations? YES/NO

Electroplated Gold COMPLIANCE

14.8.1.C Is the thickness recorded as a quality record? YES/NO

14.8.2.C Is preventative maintenance performed for cleaning of electrical contact areas? YES/NO

14.8.3.C Is the bath chemistry monitored and controlled per manufacturer’s recommendations?

YES/NO

14.8.4.C Is XRF being used to measure thickness? YES/NO

14.9 Electroplated Silver N/A

14.9.1.P Is there a procedure for electroplated silver finishing? YES/NO

14.9.2.P Is there a procedure establishing that chemical parameters are within the chemistry Suppliers’ recommendations? YES/NO

Electroplated Silver COMPLIANCE

14.9.1.C Does the agitation assure solution flow through the holes? YES/NO

14.9.2.C Is the thickness recorded as a quality record? YES/NO

14.9.3.C Is the process being monitored and controlled for temperature per manufacturer’s specifications? YES/NO

14.9.4.C Is the bath chemistry monitored and controlled per manufacturer’s recommendations?

YES/NO

14.9.5.C Is preventative maintenance performed for cleaning of electrical contact areas? YES/NO

14.9.6.C If manual scrubbing is used in the final clean process, is there an inspection to assure that there is no smear between traces? YES/NO/N/A

14.9.7.C Is XRF being used to measure thickness? YES/NO

14.10 Electroplated Nickel N/A

14.10.1.P Is there a procedure for electroplated nickel finishing? YES/NO

14.10.2.P Is there a procedure establishing that chemical parameters are within the chemistry Suppliers’ recommendations? YES/NO

14.10.3.P If there is a requirement for hardness testing, is there traceability to The National Institute for Standards and Technology (NIST)? YES/NO/N/A

Electroplated Nickel COMPLIANCE

14.10.1.C Does the agitation assure solution flow through the holes? YES/NO

14.10.2.C Is the thickness recorded as a quality record? YES/NO

14.10.3.C Is the process being monitored and controlled for temperature per manufacturer’s specifications? YES/NO

14.10.4.C Is the bath chemistry monitored and controlled per manufacturer’s recommendations?

YES/NO

14.10.5.C Is preventative maintenance performed for cleaning of electrical contact areas? YES/NO

14.10.6.C If manual scrubbing is used in the final clean process, is there an inspection to assure that there is no smear between traces? YES/NO/N/A

14.10.7.C Is XRF being used to measure thickness? YES/NO

14.11 Electroplated Palladium N/A

14.11.1.P Is there a procedure for electroplated palladium finishing? YES/NO

14.11.2.P Is there a procedure establishing that chemical parameters are within the chemistry Suppliers’ recommendations? YES/NO

Electroplated Palladium COMPLIANCE

14.11.1.C Does the agitation assure solution flow through the holes? YES/NO

14.11.2.C Is the thickness recorded as a quality record? YES/NO

14.11.3.C Is the process being monitored and controlled for temperature per manufacturer’s specifications? YES/NO

14.11.4.C Is the bath chemistry monitored and controlled per manufacturer’s recommendations?

YES/NO

14.11.5.C Is preventative maintenance performed for cleaning of electrical contact areas? YES/NO

14.11.6.C If manual scrubbing is used in the final clean process, is there an inspection to assure that there is no smear between traces? YES/NO/N/A

14.11.7.C Is XRF being used to measure thickness? YES/NO

14.12 Final Plating Rinse N/A

14.12.1.P Is there a procedure for verifying final rinse acceptance requirements? YES/NO

Final Plating Rinse COMPLIANCE

14.12.1.C Is deionized (DI) or reverse osmosis (RO) treated water used for the final finish rinse? YES/NO

14.12.2.C Is there objective evidence that the final rinse acceptance criteria

have been met and are in accordance with the requirements of the procedure? YES/NO

14.13 Organic Solder Preservative (OSP) N/A

14.13.1.P Is there a procedure for the application of an OSP finish? YES/NO

14.13.2.P Is there a procedure establishing that chemical parameters are within the chemistry Suppliers’ recommendations? YES/NO

Organic Solder Preservative (OSP) COMPLIANCE

14.13.1.C Is the bath monitored and controlled to the manufacturer’s specifications? YES/NO

14.13.2.C Is the process controlled for thickness and dwell time? YES/NO

14.13.3.C Are there deionized (DI) water rinse steps? YES/NO

14.13.4.C Is the process being monitored and controlled for temperature per manufacturer’s specifications? YES/NO

14.13.5.C Are gloves used for handling in all operations after OSP application? YES/NO