1 SCOPE
This checklist supplements the TPG-AC7119 core checklist. This checklist shall apply to suppliers seeking accreditation engaged in fabrication of organic High Density Interconnect (HDI) Printed Boards (PBs) and/or HDI layers with microvia technology working in accordance with the Class 3 requirements of IPC-6012 and IPC-6016 Standards or standards as directed by Customer.
1.1 Purpose
Approval to the requirements of TPG-AC7119 is a prerequisite for accreditation to this
supplemental checklist.
2 GENERAL INSTRUCTIONS
References
IPC Publications: Available from IPC, 3000 Lakeside Drive, Suite 309S, Bannockburn, IL 60015-
1219
IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
IPC-6016: Qualification & Performance Specification for High Density Interconnect (HDI)
Layers or Boards
3 COMPANY INFORMATION
3.1 Audit Scope
The process scopes below identify the contents of the checklist. The auditor is expected to utilize
the eAuditNet scope verification process to identify the process scopes that are utilized internally.
The column for internal is to be used only when utilizing the paper checklist (e.g. internal / pre audits). Any process scopes that are outsourced are to be identified in the table below.
Para Ref Process Internal Outsourced
4.0 General [ ] [ ]
5.0 Hole Filling Material Control
5.1 Conductive Hole Fill Material for Blind and Buried Vias [ ] [ ]
5.2 Non Conductive Hole Fill Material for Blind and Buried Vias [ ] [ ]
6.0 Inner Layers Registration [ ] [ ]
7.0 Material Lamination [ ] [ ]
8.0 Drilling
8.1 Mechanical Drilling [ ] [ ]
8.2 Laser Drilling [ ] [ ]
9.0 Via Hole Filling Process
9.2 Oxide Coating / Oxide Replacement Coating [ ] [ ]
9.3 Buried Via Hole Filling Process [ ] [ ]
9.4 Blind Via Hole Filling Process [ ] [ ]
10.0 Final Validation
10.1 General [ ] [ ]
10.2 Lifted Lands [ ] [ ]
10.3 Workmanship (shop floor) [ ] [ ]
10.4 Dimensional Requirements
10.4.1 Hole Pattern Accuracy [ ] [ ]
10.4.2 Registration (Internal) [ ] [ ]
10.4.3 Annular Ring (External) [ ] [ ]
10.5 Conductor Definition
10.5.1 Conductor Width [ ] [ ]
10.6 Structural Integrity
10.6.1 Microvia Integrity [ ] [ ]
10.6.2 Filled Vias [ ] [ ]
3.0 COMPLIANCE
There shall be a minimum of (1) job audit completed for this compliance section. As many job audits shall be performed as needed to cover the full scope.
Additional jobs shall be identified by process segment.
The audit results (eAuditNet) shall not include any customer proprietary information or technical information on parts designated "Export Controlled - License Required" (EC-LR). If Auditors have any questions about this, they should contact the PRI Staff Engineer for directions.
3.0.1.C Job 1 Indentity (Info)
3.0.1.1.C Purchase Order Number: ___________________________________
3.0.1.2.C Customer (and Prime, if known): _____________________________
3.0.1.3.C Part Number:_________________________________________
3.0.1.4.C Part Description:______________________________________
3.0.1.5.C Date of Job and Job Number:________________________________
3.0.1.6.C Material Type(s):______________________________________
3.0.1.7.C Customer Specification:________________________________
3.0.1.8.C Process Segment: ____________________________________
3.0.1.9.C Comments: ______________________________________________