procedure? YES/NO

19.9.C If the saponifier is being used for cleaning, is the saponifier within shelf life? YES/NO/N/A

19.10.C Is cleanliness verified and recorded according to procedure? YES/NO

19.11.C Is there objective evidence that the time between soldering and cleaning has been limited to the maximum value specified in procedure? YES/NO

19.12.C Are the procedures being followed for the setup, operation and maintenance of all cleaning equipment? YES/NO

19.13.C If required, does the resistivity / conductivity of final rinsing solution meet the level specified in procedure, and is it monitored according to the procedure? YES/NO/N/A

19.14.C If ultrasonic cleaning is being performed, is it in accordance with J-STD-001? YES/NO/N/A

19.15.C Has personnel been trained on the use of the equipment? YES/NO

19.16.C If unclean or mechanically damaged assemblies are found, are they identified and is there evidence of containment and corrective action? YES/NO/N/A

19.17.C If rework has been performed, is there evidence that the cleaning steps required for the material used have been performed (no-cleaning for no-clean or cleaning performed subsequent to the rework)? YES/NO/N/A

20 COATING AND ENCAPSULATION N/A

20.1.P Is there a procedure that identifies coating and or encapsulation product type that meets the customer requirements? YES/NO

20.2.P If allowed by the customer Is there a procedure that identifies and covers localized removal of coating and or encapsulation including product type? YES/NO/N/A

20.3.P Are there procedures that define:

a.P - Minimum cleanliness requirement for the Circuit Card Assembly? YES/NO

b.P - Method of ensuring cleanliness? YES/NO

c.P - Shelf life of coating and encapsulation material? YES/NO

d.P - Method of verification of correct coating and encapsulation material? YES/NO

e.P - Work time after mixing / pot-life? YES/NO

f.P - Methods for coating / encapsulation application and removal? YES/NO

g.P - Application and removal of temporary masking material, if used? YES/NO/N/A

h.P - ESD safe temporary masking, if used? YES/NO/N/A

i.P - Setup and configuration (tools, fixtures, jigs, programs)? YES/NO

j.P - Cleaning of tooling (fixture, nozzle, racks, gauges etc…)? YES/NO

k.P - Calibration of gauges, if required? YES/NO/N/A

l.P - Temperature, humidity, ventilation of the room? YES/NO

m.P - If required by customer, verification of thickness and hardness of the coating? YES/NO/N/A

n.P - Visual Inspection of coating to include coverage, bubbles, adhesion, cleanliness, marking readability, location, acceptable level of cure? YES/NO

o.P - Visual Inspection of encapsulation (coverage, fill level, bubbles, adhesion, cleanliness, spillage, cracks etc…), if encapsulation is done? YES/NO/N/A

p.P - Verification of completed traveler, including reworks? YES/NO

20.4.P Does a procedure exist to ensure connectors are not contaminated with coating? YES/NO

20.5.P If assembly coated by dipping, is there a procedure to control the dip line on the board?

YES/NO/N/A