8 INNER LAYERS N/A

8.1 Inner Layer Photoprocess N/A

8.1.1.P Is there a procedure for inner layer photoprocess? YES/NO

8.1.1.1.P Does the procedure define the environmental temperature and humidity control requirements? YES/NO

8.1.1.2.P Does the procedure require the temperature and humidity levels achieved to be recorded electronically or by chart recorders over time? YES/NO

8.1.2.P Is there a procedure for control of airborne particulate contamination? YES/NO

8.1.3.P Is there a procedure that ensures hold-time is consistent with the photo-resist being used? YES/NO

8.1.4.P Is there a procedure for managing the relationship between light intensity and exposure time? YES/NO

8.1.5.P Is there a procedure for removing static and contaminants from the surfaces of the photo tool (artwork), tooling and imaging frame? YES/NO

8.1.6.P Is there a process that ensures the integrity of the production photo tool (artwork) prior to use? YES/NO

8.1.7.P If removal of resist for reprint is performed, is there a procedure for resist removal?

YES/NO/N/A

Inner Layer Photoprocess COMPLIANCE

8.1.1.C Are there environmental controls for temperature and humidity for phototooling storage and/or inspection? YES/NO

8.1.2.C Are there chart recorders or electronic data collection files for the temperature and humidity readings? YES/NO

8.1.3.C Is the hold-time consistent with the photo-resist being used? YES/NO

8.1.4.C Is the relationship between light intensity and exposure time managed? YES/NO

8.1.5.C Is there objective evidence that the integrity of the production photo tool (artwork) is being maintained as required by the process? YES/NO

8.1.6.C Is the process to verify the dimensional accuracy of the photo plotter (a calibrated source, Automated Optical Inspection (AOI), or equivalent) being followed? YES/NO

8.1.7.C Is the control of airborne particulate within the area per the requirements of the procedure? YES/NO

8.1.8.C Is there evidence that the procedure for static and contaminant removal is being followed? YES/NO

8.1.9.C If removal of resist for reprint is performed, is it done according to procedure?

YES/NO/N/A

8.2 Inner Layer Develop – Etch – Strip (DES) N/A

8.2.1.P Is there a procedure for controlling the parameters used for resist development? YES/NO

8.2.2.P Is there a procedure for inner layer etch, which includes control of chemistries?YES/NO

8.2.3.P Is there a procedure for the stripping of resist? YES/NO

8.2.4.P Is there a procedure that defines the method of handling product post inner layer etch which minimizes risks associated with handling damage? YES/NO

Inner Layer Develop – Etch – Strip (DES) COMPLIANCE

One of the following two questions (8.2.1.C or 8.2.2.C) shall be answered, both cannot be marked N/A:

8.2.1.C If the system is not automated, are the breaks or set points identified for each lot through

the develop-etch-strip process? YES/NO/N/A

8.2.2.C If the system is automated, are there defined break points or set points? YES/NO/N/A

8.2.3.C Are the defined handling methods being performed post inner layer etch as per the procedure? YES/NO

8.2.4.C Is there monitoring of spray nozzles to ensure full coverage or flow? YES/NO

8.2.5.C Are conveyor speeds being maintained within the defined limits? YES/NO

8.2.6.C Are the chemistries used for inner layer etch being controlled as per the procedure? YES/NO

8.2.7.C Are the parameters used for resist development being controlled according to the procedure? YES/NO

8.3 Inner Layer Inspection N/A

8.3.1.P Is there a procedure for etched image inspection? YES/NO

8.3.2.P Is there a procedure defining a trigger which initiates documented corrective action when process non-conformances are found? YES/NO

8.3.3.P If AOI is performed, is there a procedure requiring that only engineering source files be used to generate the AOI program? YES/NO/N/A

8.3.4.P If circuit repair is performed, is there a procedure for obtaining Customer approval? YES/NO/N/A

Inner Layer Inspection COMPLIANCE

8.3.1.C Is there objective evidence that the procedure for inspection of underetch or overetch throughout the panel area is being followed? YES/NO

8.3.2.C Are line width and space parameters controlled? YES/NO

8.3.3.C If non-conformances are identified, is there objective evidence that the procedure for the initiation of corrective action is being followed? YES/NO/N/A

8.3.4.C If used, were only engineering source file data used to generate the AOI program? YES/NO/N/A

8.3.5.C If circuit repair is performed, was there objective evidence of prior Customer

authorization? YES/NO/N/A

8.4 Laser Direct Imaging (LDI) N/A

8.4.1.P Is there a procedure for LDI? YES/NO

8.4.1.1.P Does the procedure define the environmental temperature and humidity control requirements? YES/NO

8.4.1.2.P Does the procedure require the temperature and humidity levels achieved to be recorded electronically or by chart recorders over time? YES/NO

Laser Direct Imaging (LDI) COMPLIANCE

8.4.1.C Is the procedure for LDI being followed? YES/NO

8.4.2.C Are the programs used for LDI verified from processinstructions? YES/NO

9 OXIDE COATING / OXIDE REPLACEMENT COATING N/A

9.1.P Is there a procedure for oxide coating or oxide replacement coating? YES/NO

9.2.P Is there a maximum number of rework cycles on inner layers? YES/NO

OXIDE COATING/OXIDE REPLACEMENT COATING COMPLIANCE

9.1.C Is there monitoring of the copper reduction through the oxide process? YES/NO

9.2.C If oxide coating/oxide replacement coating repair has been performed was the limitations on the maximum number of reworks adhered to? YES/NO/N/A