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  • TGP风能电力特殊工序

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    电子印制板审核准则(6)成都TPG_AC7119
    发表时间:2021-06-29     阅读次数:     字体:【

    10 MATERIAL LAMINATION N/A

    10.1.P Is there a procedure for each lamination method? YES/NO

    10.2.P Is there a procedure clearly defining the lamination stack-up / lay-up processes? YES/NO

    10.3.P If laminate registration verification is not an automated calibration process, is there a procedure for laminate registration verification? YES/NO/N/A

    10.4.P If different resin systems are simultaneously available for use, is there a procedure for storage and handling to prevent cross contamination of resins? YES/NO/N/A

    MATERIAL LAMINATION COMPLIANCE

    10.1.C Are the temperature profiles traceable to each lot processed through lamination either through chart or electronic data records? YES/NO

    10.2.C If a vacuum system is used, are the defined vacuum levels being adhered to during the lamination process? YES/NO/N/A

    10.3.C Is the cool-down cycle controlled? YES/NO

    10.4.C If a post lamination bake is used to reach full cure, is there substantiation for its use based on material type? YES/NO/N/A

    10.5.C Are lamination plates cleaned after each lamination cycle and inspected for cleanliness? YES/NO

    10.6.C Is the lamination cycle defined and documented for each material configuration and readily available at the operation? YES/NO

    10.7.C If a vacuum system is used, is preventative maintenance being performed? YES/NO/N/A

    10.8.C Are the press platens profiled for temperature uniformity? YES/NO

    10.9.C If required, is there evidence that the procedure for the prevention of cross contamination between different types of resins is being followed? YES/NO/N/A

    10.10.C If required, is the laminate registration verified per the procedure? YES/NO/N/A

    11 DRILLING N/A

    11.1 Mechanical Drilling N/A

    11.1.1.P Is there a procedure that covers all the drilling operations including the definition of speed and feed parameters? YES/NO

    11.1.2.P Is there a procedure to address PB stack quantities and stack height parameters? YES/NO

    11.1.3.P Is there a procedure which includes registration compensation? YES/NO

    11.1.4.P Is there a procedure which includes first piece inspection by x-ray verification? YES/NO

    11.1.5.P Is there a procedure to address drill bit life? YES/NO

    11.1.6.P Is there a system for detecting broken bits and verifying drill size? YES/NO

    11.1.7.P Is there a procedure for determining conformance of PB’s experiencing broken drill bits during processing and reestablishing the drill process? YES/NO

    11.1.8.P Is there a procedure for the identification (e.g. lot number, panel number or location, PB serial number) of PB nonconformances that were due to broken drill bits during processing?

    YES/NO

    11.1.9.P Is there a procedure for the disposition of PB nonconformances that were due to broken drill bits during processing? YES/NO

    Mechanical Drilling COMPLIANCE

    11.1.1.C Is the drill program verified from process instructions? YES/NO

    11.1.2.C Is there a vacuum system present at the hole during the drilling process? YES/NO

    11.1.3.C Is there a verification of drill sizes for each lot processed? YES/NO

    11.1.4.C Is there a verification of first piece for each new lot processed? YES/NO

    11.1.5.C Is there revision control of program download? YES/NO

    11.1.6.C Have only engineering source file data been used to produce the drill program? YES/NO

    11.1.7.C Is preventative maintenance performed on the vacuum system? YES/NO

    11.1.8.C Are there records of the XY position and run-out testing for each machine as part of a scheduled maintenance? YES/NO

    11.1.9.C Is there an X-ray verification used for each lot prior to production drilling? YES/NO

    11.1.10.C Is the control of PBs experiencing broken drill bits during processing and the

    determination of their conformance being performed in accordance with the procedure?

    YES/NO

    11.1.11.C Is the determination to continue/re-establish the drill process in accordance with the procedure? YES/NO

    11.1.12.C Are the required speeds and feed parameters being used? YES/NO

    11.1.13.C If XY hole-locations are allowed to be modified, are modifications within limits specified in the procedure? YES/NO/N/A

    11.1.14.C Is the procedure for drill bit life being followed? YES/NO

    11.2 Laser Drilling N/A

    11.2.1.P Is there a procedure for laser drilling? YES/NO

    11.2.2.P Is there a procedure for adjusting beam focus? YES/NO

    11.2.3.P

    If it is not part of the automated calibration software is there a procedure for power settings based on raw material types, build-up configurations and hole diameter? YES/NO/N/A

    Laser Drilling COMPLIANCE

    11.2.1.C

    Is the drill program verified from process instructions? YES/NO

    11.2.2.C Is the power level monitored for constancy? YES/NO

    11.2.3.C Is the laser drilling used for blind and/or buried vias done according to the procedure?

    YES/NO

    11.2.4.C Is there revision control of program download? YES/NO

    11.2.5.C Have only engineering source file data been used to produce the drill program? YES/NO

    11.2.6.C Is the laser used for drilling adjusted in terms of beam focus and power in accordance with the procedure? YES/NO

    11.2.7.C Is there evidence that registration is being verified for each lot prior to production drilling? YES/NO

    11.3 Post-Drill Cleaning N/A

    11.3.1.P Is there a procedure for resin smear removal according to Customer specifications?

    YES/NO

    11.3.2.P Is there a procedure for foil burr removal? YES/NO

    11.3.3.P If plasma etch is used, is there a procedure that covers temperature ranges, bake steps and residue removal? YES/NO/N/A

    Post-Drill Cleaning COMPLIANCE

    11.3.1.C If plasma etch is used, are the parameters per the procedure? YES/NO/N/A

    11.3.2.C Is the foil burr removal process monitored for hole-quality? YES/NO

    11.3.3.C If required for laser drilling (ablation), is there verification of capture land cleanliness? YES/NO/N/A

    11.3.4.C Is there evidence that the procedure for resin smear removal is being followed? YES/NO


     
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