12 ELECTRONIC COMPONENT PREPARATION FOR PREASSEMBLY PROCESS N/A

12.1.P Are there procedures that define:

a.P - Method of verifying that the kit of components has been prepared and setup correctly? YES/NO

b.P - Control and use of equipment including unique identification and configuration control? YES/NO

c.P - Control of soldering, tinning, flux and solder to be used, temperature, process dwell times, and component type specific processing requirements, pot purity maximum contaminants that comply to J-STD-001? YES/NO

d.P - Preparation operations, including verification of components (bend radius)? YES/NO/N/A

e.P - Method of application and control of temporary masking where required? YES/NO/N/A

f.P - Verification of coplanarity SMT components after forming? YES/NO/N/A

g.P - Re-identification requirements of parts after preparation? YES/NO/N/A

h.P - Gold removal in accordance with J-STD-001 and customer requirements? YES/NO/N/A

ELECTRONIC COMPONENT PREPARATION FOR PREASSEMBLY PROCESS COMPLIANCE

12.1.C If moisture sensitive components are being used, is there evidence of moisture control? YES/NO/N/A

12.2.C If kitting is performed, is there objective evidence of independent verification of the kit? YES/NO/N/A

12.3.C If lead forming is performed, are the tools used for lead forming in accordance with the ESD protection procedure? YES/NO/N/A

12.4.C If defined by procedure, are the parts re-identified after preparation?

YES/N/N/A

12.5.C Is the procedure being followed for control and use of equipment? YES/NO

12.6.C Is the procedure being followed for control of soldering, tinning, flux and solder to be used (ex. analysis of solder purity - gold embrittlement), temperature, process dwell times, component type specific processing requirements? YES/NO

12.7.C Has the operator been trained for handling, ESD, and prep operations, including inspection of components after processing for compliance to requirements? YES/NO

12.8.C If required, is the application of temporary masking in accordance with the procedure? YES/NO/N/A

12.9.C If SMT components are formed, is coplanarity being verified? YES/NO/N/A

12.10.C After component preparation operations, are the components verified that they are compliant to requirements? YES/NO

12.11.C If required, is the procedure for gold removal being followed? YES/NO/N/A