13 STENCIL PRINTING N/A

13.1.P Are there procedures that define:

a.P - Validation of solder paste per part number? YES/NO

b.P - Storage, conditions of use, and control of solder paste integrity? YES/NO

c.P - Equipment setup including screen orientation, program choice, PB support configuration?

YES/NO

13.2.P Is there a procedure for stencil design definition and validation, which includes stencil thickness, aperture size, use and size of step-downs and stencil material type?YES/NO

13.3.P Are there procedures for maintenance of stencils following use, which include cleaning?

YES/NO

13.4.P Are there procedures to control the solder paste printing (solder paste coverage, alignment, shape and inspection rate)? YES/NO

13.5.P Is there a procedure for cleaning and inspection of misprinted PBs? YES/NO

STENCIL PRINTING COMPLIANCE

13.1.C Is paste stored according to the manufacturer specifications? YES/NO

13.2.C Is the paste shelf life being controlled according to the procedure? YES/NO

13.3.C Has the supplier ensured that the paste is used as defined in the procedure for the PB currently in process? YES/NO

13.4.C If required, is the paste warm-up according to the procedure? YES/NO/N/A

13.5.C If performed, is the paste reconditioning limited according to the procedure? YES/NO/N/A

13.6.C Is solder paste from any misprinted PB not allowed to be re-used? YES/NO

13.7.C Is cross contamination between pastes prevented according to the procedure? YES/NO

13.8.C Are controls of blade integrity done before starting production? YES/NO

13.9.C Is program versus PB checked during the setup? YES/NO

13.10.C Are stencil printing parameters adjusted in accordance with the procedure? YES/NO

13.11.C Is there a control of temperature versus time before reflow, per procedure or

manufacturer’s recommendation? YES/NO

13.12.C Are the preventive maintenance activities on solder paste printer completed? YES/NO

13.13.C Is there objective evidence that personnel are trained for stencil printing process? YES/NO