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    无锡市TPG_AC7120认证_AC7120_电路卡组件的审核标准(13)
    发表时间:2021-07-16     阅读次数:     字体:【

    16 BONDING N/A

    16.1.P Are there procedures that define:

    a.P - Cleanliness acceptance criteria of assembly and applicable components prior to bonding?

    YES/NO

    b.P - Surface preparation, if required? YES/NO/N/A

    c.P - Configuration of tools? YES/NO

    d.P - Tool selection? YES/NO

    e.P - Packaging during process / transit? YES/NO

    f.P - Environmental storage control of bonding materials? YES/NO

    g.P - Mixing requirements for adhesives? YES/NO/N/A

    Audit Note: N/A applies to single part dispensed and /or self mixing dispensable adhesives only.

    h.P - Working time of adhesives? YES/NO

    i.P - Curing for adhesives? YES/NO

    j.P - Application processes for adhesives (dispensing, etc.)? YES/NO

    k.P - Verification that adhesive preforms are to dimensions provided, if preforms are used? YES/NO/N/A

    l.P - Specification and verification of intensity of UV light source per bonding material manufacturer’s information, if UV cure is used? YES/NO/N/A

    m.P - The wavelength for the cure of UV light source per bonding material manufacturer’s information, if UV cure is used? YES/NO/N/A

    n.P - Retention of coupons, if required? YES/NO/N/A

    o.P - Cure and alignment? YES/NO

    p.P - Workmanship requirements? YES/NO

    q.P - Lamination parameters, if lamination is used? YES/NO/N/A

    r.P - Recorded test results (lap shear after curing, adhesive bond level strength), if required?

    YES/NO/N/A

    s.P - Rework methods by material type? YES/NO

    t.P - Control of the use of under fill, If used? YES/NO/N/A

    BONDING COMPLIANCE

    16.1.C Have assembly and applicable components met the cleanliness criteria as established in procedure? YES/NO

    16.2.C Are age-sensitive materials identified with expiration dates? YES/NO

    16.3.C If required, is surface preparation performed according to procedure? YES/NO/N/A

    16.4.C Is the work instruction for bonding being followed? YES/NO

    16.5.C Is the tooling marked with the correct identification? YES/NO

    16.6.C Are the tools specified in the procedure being used? YES/NO

    16.7.C Is the packaging being used as required in the procedure? YES/NO

    16.8.C Are adhesives mixed according to procedure? YES/NO/N/A

    Audit note: N/A applies to single part dispensed and /or self mixing dispensable adhesives only.

    16.9.C Are the working times of adhesives within time limits defined in the procedure? YES/NO

    16.10.C Are adhesive curing procedures being followed? YES/NO

    16.11.C Are adhesives applied by the processes defined in the procedure? YES/NO

    16.12.C If used, are pre-forms dimensions verified? YES/NO/N/A

    16.13.C If UV cure is used, is the intensity of UV light source verified per bonding material manufacturer’s information? YES/NO/N/A

    16.14.C If UV cure is used and wavelength is relevant for the cure, is the wavelength of the UV light source per bonding material manufacturer’s information? YES/NO/N/A

    16.15.C Where required, are coupons retained according to procedure? YES/NO/N/A

    16.16.C If lamination is used, are lamination parameters being met as defined in procedure? YES/NO/N/A

    16.17.C If required, are test results recorded and available? YES/NO/N/A

    16.18.C If underfill is used, is the procedure being followed? YES/NO/N/A

    16.19.C Is the rework being performed per the procedure? YES/NO

    16.20.C Are the bonding materials being used and stored as per the procedure and to

    manufacturer’s recommendations? YES/NO


     
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