17 ASSEMBLY SOLDERING PROCESSES N/A

17.1 Reflow Soldering: N/A

17.1.1.P Are there procedures that define:

a.P - Moisture control and/or baking for PB/CCA? YES NO

b.P - Moisture control for sensitive components based on J-STD-033 and/or JSTD-020, unless otherwise specified by customer? YES/NO

c.P - Method of initial program validation, validation of revisions including authorization rules?

YES/NO

d.P - Setup of equipment, programs and tools including temperatures, speeds, atmosphere, etc.?

YES/NO

e.P - Profile traceability? YES/NO

f.P - Inspection plan? YES/NO

g.P - Monitoring of controlled atmosphere, if used? YES/NO/N/A

h.P - Cleaning method and maximum time permitted between reflow and clean for each paste chemistry used? YES/NO

Audit Note: Maximum allowed time of 8 hours unless otherwise specified by customer or manufacturer’s recommendation.

Reflow Soldering COMPLIANCE

17.1.1.C Are the PB / CCA being controlled to minimize moisture ingress in accordance with the procedure? YES/NO

17.1.2.C If used, are moisture sensitive components handled in accordance with the procedure?

YES/NO/N/A

17.1.3.C Is the maximum time permitted between solder paste application and reflow not being exceeded?YES/NO

17.1.4.C Is the qualified paste being used for the part number being soldered? YES/NO

17.1.5.C Is set-up of equipment being carried out according to the procedure? YES/NO

17.1.6.C Is the profile in use being monitored according to the procedure to assure compliance to the defined requirements for temperature and time parameters? YES/NO

17.1.7.C If controlled atmosphere is used, is the procedure for monitoring being followed?

YES/NO/N/A

17.1.8.C Are all drawings, machine programs, written instructions, product specific fixtures under configuration control, and do they match the Assembly traveler? YES/NO

17.1.9.C Is there evidence that the preventive maintenance is complete, including thermocouple calibration, periodic cleaning of equipment and tools? YES/NO

17.1.10.C Is there evidence of program validation and approval per procedure? YES/NO

17.1.11.C Is there evidence that the method of program revision is being followed? YES/NO

17.1.12.C Are the work instructions including the sequence of operation being followed? YES/NO

17.1.13.C Is there evidence that the inspection plan is being followed? YES/NO

17.1.14.C Are soldering defects including solder joint touchup identified, recorded and addressed in a continuous improvement plan? YES/NO